Alphacool ES Jet LGA 4677 2U CPU Cooler | Nickel-Plated Copper Base, Acetal Housing, 2x G1/4" Ports, 118.5x75.5x23.5mm, up to 800W
IDR 4994700
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The ES Jet CPu cooler is able to reliably dissipate waste heat of up to 800 watts, providing optimal cooling for powerful processors.
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Rincian Produk
- CPU cooler was specially developed for powerful processors on Intel's LGA 4677 socket in server and workstation systems
- Water is distributed over four nozzles over the radiator floor
- Materials: nickel-plated copper and acetal
- Connections: 2 x G1/4"
- Dimensions (L x W x H): 118.50 x 75.50 x 23.50mm
| Power Connector Type | 3-Pin |
| Voltage | 1 volts |
| Wattage | 1 watts |
| Cooling Method | Water |
| Compatible Devices | Desktop |
| Material Type | Nickel Plated Copper |
| Brand Name | Alphacool |
| Global Trade Identification Number | 04250197102285 |
| Manufacturer | Alphacool |
| Number of Items | 1 |
| Item Weight | 1.2 pounds (540 grams) |
| Model | 10228 |
| Part Number | 10228 |
| Brand | Alphacool |
| Material | Nickel Plated Copper |
DESKRIPSI PRODUK
Pertanyaan & Jawaban Pelanggan
-
pertanyaan:
Is this cooler compatible with AMD processors?
menjawab: Yes, it is also compatible with AMD SP5 LGA 6096 processors if available. -
pertanyaan:
What is the thermal conductivity of the included thermal paste?
menjawab: The Alphacool Subzero thermal paste has a thermal conductivity of 16 W/mK. -
pertanyaan:
What materials are used in the construction of this CPU cooler?
menjawab: The cooler is made from nickel-plated copper and acetal.
Alphacool Water Cooling Systems Editorial Review
Customer Reviews & Ratings
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IDR 4994700
Pesan sekarang dan dapatkan kira-kira pada Jumat, Agustus 21
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Fitur & Manfaat
- Designed specifically for Intel's LGA 4677 socket processors.
- Innovative four-nozzle technology ensures optimal cooling coverage.
- Capable of dissipating waste heat up to 800 watts.
- Constructed from nickel-plated copper for superior thermal conductivity.
- Compact and space-saving design ideal for server racks.
- Includes high-performance thermal paste for efficient heat transfer.
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