Features & Benefits
- Outstanding thermal conductivity ensures effective heat dissipation.
- Solid at room temperature, liquefies above 45°C for optimal performance.
- Electrically non-conductive, making it versatile for various applications.
- Low viscosity in liquid state minimizes pump-out effect.
- Durable with a long service life compared to traditional thermal pastes.
- Easy to use and ideal for processors and graphics chips.